Si3N4 Ceramic PCB High-Performance 96% Substrate with 80 W/MK Thermal Conductivity
(Note: PCBs are custom-made products; images and specifications provided are for reference only.)
Brief Introduction
This single-sided ceramic PCB is constructed with 96% silicon nitride (Si3N4) ceramic substrates, utilizing Active Metal Brazing (AMB) technology. The AMB-Si3N4 ceramic circuit board offers high thermal conductivity, excellent insulation, and a thermal expansion coefficient that matches semiconductor chips. With a heavy copper layer of 100um (2.85oz), this PCB ensures efficient current flow and features thick gold plating for reliable connections, protecting against oxidation and wear. Designed without solder masks or silkscreen, it provides maximum customization flexibility and is fabricated to IPC Class-2 standards.
Basic Specifications
PCB Size: 42 mm x 41 mm (1 piece)
Layer Count: Single-sided ceramic PCB
Thickness: 0.25 mm
Base Material: 96% Si3N4 Ceramic Substrates
Surface Finish: Gold plated
Thermal Conductivity: 80 W/MK
Copper Weight: 100um (2.85oz)
Gold Thickness: ≥1um (39.37 micro-inch)
No Solder Mask or Silkscreen
Technology: Active Metal Brazing (AMB)
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PCB Specifications
| PCB SIZE | 42 x 41mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided Ceramic PCB |
| Surface Mount Components | YES |
| Through Hole Components | N/A |
| LAYER STACKUP | copper ------- 100um(2.85oz) |
| Si3N4 Ceramic -0.25mm | |
| copper ------- 100um(2.85oz) | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 25mil / 25mil |
| Minimum / Maximum Holes: | 0.5mm / 1.0mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 2 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | Si3N4 Ceramic -0.25mm |
| Final foil external: | 2.85 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.3 mm ±0.1mm |
| PLATING AND COATING | |
| Surface Finish | Electroplated Gold (hard gold) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Non Plated Through Hole(NPTH) |
| FLAMIBILITY RATING | 94 V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Active Metal Brazing (AMB) Technology
The AMB (Active Metal Brazing) process involves using active elements in the brazing filler metal, like titanium, which react with the ceramic to create a bonding layer that allows for soldering between the ceramic and metal.
Si3N4 Ceramic Substrates
Si3N4 ceramic substrates are advanced materials known for their exceptional mechanical, thermal, and electrical properties, making them ideal for high-performance applications. These substrates are fully customizable to meet specific customer requirements, including tailored thicknesses and surface treatments. Their low coefficient of thermal expansion (CTE) ranges from 2.5 to 3.1ppm/K (40-400°C), closely matching silicon and reducing thermal stress in electronic devices. With a thermal conductivity of 80 W/(m·K) at 25°C, they efficiently dissipate heat, making them suitable for high-power and high-temperature environments.
Data Sheets
| 1.Ceramic Parameters | |||
| Items | Unit | Al2O3 | Si3N4 |
| Density | g/cm3 | ≥3.3 | ≥3.22 |
| Roughness (Ra) | μm | ≤0.6 | ≤0.7 |
| Bending strength | Mpa | ≥450 | ≥700 |
| Coefficient of thermal expansion | 10^-6/K | 4.6~5.2 (40-400℃) | 2.5~3.1 (40-400℃) |
| Thermal conductivity | W/(m*K) | ≥170 (25℃) | 80 (25℃) |
| Dielectric constant | 1MHz | 9 | 9 |
| Dielectric loss | 1MHz | 2*10^-4 | 2*10^-4 |
| Volume resistivity | Ω*cm | >10^14 （25℃) | >10^14 （25℃) |
| Dielectric strength | kV/mm | >20 | >15 |
| 2. Material Thickness | ||||||
| Copper Thickness | ||||||
| 0.15mm | 0.25mm | 0.30mm | 0.50mm | 0.8mm | ||
| Ceramic Thickness | 0.25mm | Si3N4 | Si3N4 | Si3N4 | Si3N4 | - |
| 0.32mm | Si3N4 | Si3N4 | Si3N4 | Si3N4 | Si3N4 | |
| 0.38mm | AlN | AlN | AlN | - | - | |
| 0.50mm | AlN | AlN | AlN | - | - | |
| 0.63mm | AlN | AlN | AlN | - | - | |
| 1.00mm | AlN | AlN | AlN | - | - | |
Our PCB Processing Capability
We provide precision circuit processing with a line width/space of 3mil/3mil and conductor thicknesses from 0.5oz to 14oz. Our capabilities include micro-via filling, inorganic dam processes, and 3D circuit fabrication. We handle various thicknesses, such as 0.25mm, 0.38mm, 0.5mm, up to 3.0mm, and offer diverse surface treatments, including electroplated gold and nickel palladium processes.